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Smart
HeatSinks
(SHS)
offers
the patented, high performance, low cost and
compact heat sink with matrix clip system (MCS). The heat
sink’s capacity of holding power devices can be
increased transversally & longitudinally. The matrix [i,
j] with i spring clips along X
axis and j along Y axis makes it very easy for designers
to configure electronic packaging. All-in-One
solution makes designers be no longer
troubled with how to attach devices onto heat sink and
how to mount the heat sink assembly onto PCB. This heat
sink provides easiest assembly, largest surface areas
and smallest space occupation. It is the ideal type of
heat sink for high power density and small size (1U or
2U) electronic packaging with forced convention cooling.
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